ST19XL18P – K5F0A Teardown
4 Metal, 350 nanometer fabrication process, EAL4+ smart card. A device fabricated in 2002 and yet, today the latest ST19W/N series only main differences are the ROM data bus output width into the decrypt block and the fabrication process (180nm and 150nm shrink). The device was dipped into a HydroFluoric (HF) bath until the active shielding fell off. The result of this saved about 10 minutes of polishing to remove the surface oxide and Metal 4 (M4). This also helps begin the polishing process on the lower layers fairly evenly….
Blackhat TPM Talk Follow-up
Since speaking at BlackHat DC 2009, there have been several inquiries in regards to the security of the SLE66PE series smartcard family. Here are some issues that should be pointed out: We have heard, “..it took 6 months to succeed..” The reality is it took 4 months to tackle obsticles found in any <200nm device such as: Capitance/load of probe needles when chip is running. Powering the device inside the chamber of a FIB workstation. Level-shifting a 1.8v core voltage following what we learned in #1 above. Cutting out metal…
Atmel CryptoMemory AT88SC153/1608 :: Security Alert
A “backdoor” has been discovered by Flylogic Engineering in the Atmel AT88SC153 and AT88SC1608 CryptoMemory. Before we get into this more, we want to let you know immediately that this backdoor only involves the AT88SC153/1608 and no other CryptoMemory devices. The backdoor involves restoring an EEPROM fuse with Ultra-Violet light (UV). Once the fuse bit has been returned to a ‘1’, all memory contents is permitted to be read or written in the clear (unencrypted). Normally in order to do so, you need to either authenticate to the device or…