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Blogs | INSIGHTS | October 26, 2007

Decapsulated devices

Recently at Toorcon9 (www.toorcon.org), some individuals asked to see images of decapsulated parts still in their packages. I dug around and came up with some examples. Click on any of the pictures for a larger version.     Above: Dallas DS89C450     Above: Microchip dsPIC30F6013 Using our proprietary procedures, all parts remain 100% functional with no degradation after exposing the substrate.

IOActive
Blogs | INSIGHTS |

Unmarked Die Revisions :: Part I

We have noticed a few different die revisions on various Microchip’s substrates that caught our attention.  In most case when a company executes any type of change to the die, they change the nomenclature slightly.  An example is the elder PIC16C622.  After some changes, the later part was named the PIC16C622A and there was major silicon layout changes to the newer ‘A’ part. The PIC16C54 has been through three known silicon revs (‘A’ – ‘C’) and has now been replaced by the PIC16F54. However, we’ve noticed two different devices from them (PIC12F683…

IOActive

Commonalities In Vehicle Vulnerabilities

With the connected car becoming commonplace in the market, vehicle cybersecurity continues to grow more important every year. At the forefront of security research, IOActive has amassed real-world vulnerability data illustrating the general issues and potential solutions to the cybersecurity threats today’s vehicles face.

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